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winbond w25n04kwzeir

W25N04KWZEIR

4Gb QspiNAND Flash 104MHz SON8

Supplier:

Winbond

Certification:

certcert
Specification
Attribute Value
Density
4Gb
Frequency
104MHz
Temperature
-40~+85˚C
Dimension
8X6mm2
Voltage
1.7 ~ 1.95V
ECC
ECC
DTR
DTR
Package
SON - 8
Description

Introduction:
Winbond's W25N04KW is a 4Gb Serial NAND Flash memory product built on a QspiNAND platform designed to meet the needs of high-density data storage with a streamlined interface. The chip operates at a voltage range of 1.7V to 1.95V and offers a high-speed operating frequency of 104MHz. Targeted for industrial applications, it does not apply for automotive use.


Function & Applications:
The W25N04KW is utilized for storing data in embedded systems and is particularly well-suited for applications requiring more storage capacity than what traditional NOR flash can offer cost-effectively. It uses a standard SPI interface, supporting x1/x2/x4 I/O operations and enhanced functionalities like Buffer Read, Sequential Read, and integrated on-chip ECC (Error Correcting Code). This allows for error detection and correction at the flash level, reducing the processing overhead on the host controller and facilitating easier design integration. It supports Executive-in-Place (XiP), which enables direct code execution from the flash without reverting to shadowing to DRAM. Common applications include consumer electronics, industrial controllers, networking, and IoT devices.


Performance Parameters:
The memory architecture features a uniform 2KB+128B page size. It boasts impressive operation times with page read including ECC at just 50µs, page program time at 250µs(typical), and block erase time at 2ms(typical). The continuous read function enhances data transfer to the DRAM, optimizing overall system performance.


Package Types, Interface & Pin Configuration:
The W25N04KW is available in compact package types: WSON8 6x8 and TFBGA24 6x8, making it suitable for space-constrained designs. The interface adherence to QspiNAND ensures compatibility with existing SPI infrastructures, allowing for easy integration into various system layouts.


Reliability & Lifespan:
Since the W25N04KW is slated for industrial use and mass production, it is built to endure demanding operating environments, enduring temperatures ranging from -40℃ up to 105℃. The internal ECC and bad block management ensure high data integrity and reliability, drawing out the lifespan of the product in rigorous usage conditions.


Standards & Certifications:
Winbond's commitment to high-quality manufacturing standards ensures that the W25N04KW meets necessary industrial reliability and performance standards. While specific certifications aren't detailed in the provided text, products like these typically conform to various domestic and international standards, which can be confirmed by Winbond's available datasheets and regulatory documentation.


Application Cases & Reference Designs:
The W25N04KW is pertinent for use cases that require fast, high-density non-volatile memory such as digital cameras, video game consoles, and GPS systems. Reference designs might not be provided in the brief description but are often available from Winbond or embedded system development forums where developers share implementation techniques and design strategies for incorporating such flash memory into their projects.

Packaging *

In Stock: 3

MOQ: 1 / MPQ: 1

Total USD 8.77
QuantityUnit Price
1USD 8.77000
100USD 8.24000
1,000USD 7.63000
20,001 +Quote by quantity
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